Die Bonding

CIL provides both conductive and non-conductive diebonding using epoxies and eutectic solders. CIL currently has 2 fully automatic die bonders and 1 manual die bonder capable of both large throughputs but also very tight tolerance die placement. The die bonders are used for a variety of semiconductor die types including LED's, ASIC's, MEM's and Sensor's that are currently being used in applications such as Medical, Industrial and Commercial market area's. CIL is able to diebond to a variety of substrate materials including FR4, Alumina, Metallised Ceramic, Carbon Fibre and Chip on Flex as single die or multiple die arrays for Chip scale packaging / CSP's. CIL has gained extensive expertise in the bonding of Opto-electronic die / LED's creating LED arrays for a variety of applications. As well as Optoelectronic die placement CIL has extensive Thermal design / Thermal management expertise and this coupled with our design and PCB departments enables CIL to supply the supporting electronics.

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