MCM & Custom BGA's

CIL can both design and manufacture Multi chip module / MCM, Custom Ball Grid Arrays / BGA's and Chip scale packages / CSP to the following types. MCM-C that is ceramic based and MCM-L that is laminate or PCB based. These assemblies can be single or multiple die assemblies with external components or aerials / antenna. As with our thick film hybrid facility, CIL is able to produce state of the art designs to enable our customers to find solutions to all of their microelectronic / thermo / micropackaging problems. Also using our advanced SMT and test facility, including flying probe we are able to provide the complete solution.

Call +44(0)1264 321321