CIL has been designing and manufacturing thick film hybrid circuits since 1987. Using a combination of CAD design coupled with its highly automated SMT equipment and "state of the art "chip and wire bonding facility CIL is able to offer advanced solutions to customers packaging problems. We currently have a number of existing designs in continuous manufacture and a large number of new assemblies going through the new product introduction phase. We are able to process nearly all sizes and thicknesses of commercially available ceramic and are also to further process it for SMT or chip and wire products.
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