Section Links

Help & Advice? Require a Quote? Call +44(0) 1264 321321

Advanced Technologies

CIL has built up a reputation in leading edge technologies, which provide customers with higher levels of miniaturisation

You are currently in: Home > Advanced Technologies > Wire Bonding

Wire Bonding

CIL provides both Aluminium and Gold wirebonding using both wedge bonding and ball bonding. CIL has invested heavily in this area over the recent years so that it now has 2 fully automatic Aluminium Wedge bonders 1 fully automatic Gold Ball bonder plus an additional manual heavy gauge Aluminium wire bonder. The machines when coupled with our high precision die bonders give CIL a capability that is unmatched by any other independent facility within the UK for wire bonding.

Wire Bonding - CIL

Call +44(0)1264 321321

I am looking for more information on Wire Bonding

Top

Back

Electronics Manufacturing Services

SMT Board Assembly

Conventional PCB Assembly

Inspection & Testing

Electronics Product Build

Product Service and Upgrade

Materials Procurement

Engineering Support

Low-Cost Gateway

Rapid Prototyping

Fast Track Purchasing

Free Issue Materials

Production Lead-times

New Product Reporting