CIL has built up
a reputation in leading edge technologies, which provide customers with
higher levels of miniaturisation. CIL is currently the largest independent
chip and wire bonding facility in the UK and offers the following technologies
all to ISO9001:2000 quality standards.
CIL's Die Bonding Facility
DIE BONDING
CIL provides both conductive and non-conductive diebonding using epoxies
and eutectic solders. CIL currently has 2 fully automatic die bonders
and 1 manual die bonder capable of both large throughputs but also very
tight tolerance die placement. The bonders are used for a variety of semiconductor
die types including LED's, ASIC's, MEM's and Sensor's that are currently
being used in applications such as Medical, Industrial and Commercial
market area's. CIL is able to diebond to a variety of substrate materials
including FR4, Alumina, Metallised Ceramic, Carbon Fibre and Chip on Flex
as single die or multiple die arrays for Chip scale packaging / CSP's.
CIL has gained extensive expertise in the bonding of Opto-electronic die
/ LED's creating LED arrays for a variety of applications. As well as
Optoelectronic die placement CIL has extensive Thermal design / Thermal
management expertise and this coupled with our design and PCB departments
enables CIL to supply the supporting electronics.
CIL's
Wire Bonding Facility
WIRE BONDING
CIL provides both Aluminium and Gold wirebonding using both wedge bonding
and ball bonding. CIL has invested heavily in this area over the recent
years so that it now has 2 fully automatic Aluminium Wedge bonders 1 fully
automatic Gold Ball bonder and 1 manual heavy gauge Aluminium wire bonder.
The machines when coupled with our high precision die bonders give CIL
a capability that is unmatched by any other independent facility within
the UK for wire bonding.
Chip on Board Assemblies
CHIP ON BOARD
COB
CIL is the largest independent chip-on-board / chip and wire facility
in the UK. Using its automatic die / wire bonders it is able to wire bond
all commercially available semiconductor die. These include Light emitting
diodes / LED s, Asic's and MEM's, to a variety of substrate materials
including FR4, alumina, ceramic, flexi or flex circuits, using both Aluminum
wedge bonding and Gold ball bonding techniques to give the optimum results.
This is backed up with wirebond and die bond pull test and shear results
using the latest SPC techniques.
Multi Chip Module
MULTI CHIP MODULES
/ MCM
CUSTOM BALL GRID ARRAYS / BGA
CHIP SCALE PACKAGING / CSP MICROPACKAGING
CIL can both design and manufacture Multi chip module / MCM, Custom Ball
Grid Arrays / BGA's and Chip scale packages / CSP to the following types.
MCM-C that is ceramic based and MCM-L that is laminate or PCB based. These
assemblies can be single or multiple die assemblies with external components
or aerials / antenna. As with our thick film hybrid facility, CIL is able
to produce state of the art designs to enable our customers to find solutions
to all of their microelectronic / thermo / micropackaging problems. Also
using our advanced SMT and test facility, including flying probe we are
able to provide the complete solution.
THICK FILM HYBRIDS
CIL has been designing and manufacturing thick film hybrid circuits since
1987. Using a combination of CAD design coupled with its highly automated
SMT equipment and "state of the art "chip and wire bonding facility CIL
is able to offer advanced solutions to customers packaging problems.
POWER HYBRIDS
CIL has extensive design and manufacturing capability of power hybrid
and heavy gauge wire bonding to thermally conductive substrates. CIL's
engineers using a combination of CAD design and modern assembly equipment
currently supply power hybrids into a variety of market sectors.
GLOB TOP ENCAPSULATION
POTTING
CIL provides a globbing / encapsulation / potting facility to a variety
of substrate and assembly technologies. CIL has in-depth knowledge of
both semiconductor encapsulation and also complete product encapsulation
and is therefore able to help it customers solve their packaging problems.
To achieve this CIL's engineers use a variety of encapsulants including
Epoxies, Polymers, UV curing materials and will select the appropriate
material.
