CIL are experts in
leading edge SMT PCB and Through hole PCB assembly technologies. CIL has
invested heavily over the last three years and is able to offer the following
technologies all to ISO9001:2000 quality standards.
CIL's SMT Assembly
Area
SMT ASSEMBLY
CIL provides a full SMT contract assembly service to ISO9001:2000 quality
standards. Surface mount PCB assembly can be manual, semi or fully automatically
assembled, using the latest pick and place machines. CIL currently has
3 complete in-line systems using a combination of TYCO MIRAE 1030, 1030P,
1020P and 1025P placement machines all with in line automatic solder printers,
complete with 2D print inspection. CIL's machines are capable of assembling
Ball Grid Arrays / BGA's, Quad Flat Packs / QFP's and fine pitch SMD components
down to 0402 in batch sizes from 1 off to 40,000 off per month. The 3
complete in-line systems and 1 stand-alone system can use both no clean
solder and water soluble solder in conjunction with aqueous cleaning and
also lead free product.
BGA ASSEMBLY
CIL provides a full BGA assembly and BGA rework facility to ISO9001:2000
quality standards. The 2 stages to successful BGA assembly are good PCB
design and modern assembly / inspection equipment. Utilising CIL's design
department to optimise BGA pad design coupled with CIL's state of the
art SMT placement and DAGE XD7600 X-Ray inspection facility we are able
to assemble all Ball Grid Array / BGA, uBGA / micro BGA and ceramic BGA
package styles.
X-Ray image of a BGA
from XD7600
BGA REWORK/ RE-BALLING
CIL is also
able to provide a full BGA and Micro BGA rework / re-balling service using
a combination of dedicated BGA rework equipment in conjunction with in
house DAGE XD7600 X-Ray inspection. CIL has built up an expertise in BGA
rework for a number of clients both small and medium volume and currently
use the latest BGA rework equipment in the form of an ERSA PL550A plus
DAGE XD7600 XRay equipment.
CIL's IN-HOUSE XD7600
X-RAY SYSTEM
X-RAY INSPECTION
CIL also provides a full in house X-ray inspection service using the new
DAGE XD7600 XiDAT Digital Inspection System. This system is the very latest
technology and CIL are the first company to offer this machine as a sub-contract
service. Due to the work that CIL has been developing with regards to
BGA / micro BGA Design and manufacture, the decision was taken to bring
X-ray inspection in house. It is CIL's belief that you cannot process
BGA / uBGA devices with absolute confidence without offering a full X
Ray inspection service and that it must be in-house.
THRU HOLE ASSEMBLY
CIL provides a full Thru-hole or conventional PCB sub contract assembly
service using Selective Soldering, Wave soldering / flow soldering and
hand soldering technologies to ISO9001:2000. Assembly can be undertaken
using both no clean solder or water soluble solder in conjunction with
aqueous wash and or lead-free technologies
Thru Hole PCB Assemblies
TEST EQUIPMENT
As well as continual investment in assembly equipment, CIL has also been
increasing its test capability over the last few years. Most simple or
high volume products have now gone offshore and therefore what is left
manufactured in the UK are either small volume/prototypes or very complex
assemblies. As well as the ability to assemble such units, CIL also has
the capability to test these assemblies using an array of test equipment
and the necessary qualified engineers and technicians. Through a combination
of TERADYNE ICT / TAKAYA FPT / DAGE X-RAY / MARANTZ Auto Optical Inspection
/ XJTAG / JTAG Boundary Scan and functional test equipment, CIL is able
to prove most types of electronic assemblies and is therefore best qualified
to assist any future customer with their test philosophy.
TERADYNE 1820VP
ICT ATE
CIL currently uses a TERADYNE 1820VP ICT ATE tester for all of its in
circuit test (ICT) requirements. This test method is CIL's preferred method
for all PCB assemblies as it is tests both passively and actively all
components on the assembly, but the PCB must be designed accordingly.
Using this test philosophy CIL are able to guarantee that every assembly
delivered will be 100% fully tested for every component / test parameter.
Also, using a combination of ICT, flying probe and X -Ray CIL's engineers
are currently able to fault find and rectify non working products manufactured
offshore. Increasingly more and more PCB population has gone offshore,
however a high percentage of product received does not work and therefore
CIL is able to recover the non working product for a range of customers.
The TERADYNE 1820 is capable of the following...
CIL's TERADYNE Z1820VP
ICT ATE
Full analog and
digital test techniques
2048 Test points
Deltascan 2 and
Framescan (offering vectorless test)
Vector processor
offering Vector testing
Integrated BICT
boundary scan
National Instruments
IEEE interface card for remote equipment
On board Flash
device programming
On board optical
test for LED auto test
FLYING PROBE TESTING CIL currently
uses a TAKAYA APT8400 flying probe tester for its low volume test requirements.
The benefits of Fixtureless In-Circuit Test (FICT) ATE is a cost effective
option for smaller volumes and enables CIL to test all assemblies that
are manufactured. The advantages of these systems over traditional "bed
of nails" systems are well documented and with the move towards shorter
product life of PCB designs CIL are able to offer a faster time to market.
These systems are backed up by dedicated functional test equipment that
is free issued or can be designed and manufactured by CIL's engineers.
CIL's TAKAYA APT8400
FLYING PROBE ATE
MARANTZ M22XDL450
Automatic optical Inspection This system in conjunction with our other
test platforms allows CIL to offer the complete range of test solutions.
The need for AOI inspection was driven by the complexity of products now
in manufacture at CIL with some assemblies now having in excess of 2000
components with components as small as 0402. When processing both small
and large quantities of these assemblies it is impossible for normal inspection
methods to be applied as we are looking for very low levels of defects.
XJTAG BOUNDARY
SCAN
CIL currently uses XJTAG Boundary Scan as a further test tool to enable
CIL to give the very highest test coverage. This test platform used in
isolation or with a combination of our other test platforms allows us
to offer the complete test solution. As more of our assemblies now have
>1500 components using 0402 components and multiple BGA's with very high
density interconnect and digital lines resulting in node counts of >17,000/assembly,
we are able to offer the very latest test solutions which include XJTAG
boundary Scan www.xjtag.com
JTAG BOUNDARY SCAN
CIL currently uses JTAG Boundary Scan as a further test tool to enable
CIL to give the very highest test coverage. This test platform used in
isolation or with a combination of our other test platforms allows us
to offer the complete test solution. As more of our assemblies now have
>1500 components using 0402 components and multiple BGA's with very high
density interconnect and digital lines resulting in node counts of >17,000/assembly,
we are able to offer the very latest test solutions which include JTAG
boundary Scan
FUNCTIONAL TEST
EQUIPMENT
CIL also has a range of functional test equipment for finished product
test. This equipment is either free issued by customers or manufactured
by CIL for specific products. Equipment includes Spectrum analysers, Network
analysers, oscilloscopes, DVM's, Signal generators, Frequency counters
etc.
POTTING CONFORMAL
COAT
CIL provides both a Potting and Conformal coat sub contract service to
ISO9001:2000. There are currently a variety of different products in manufacture
at CIL's facilities that uses either Potting or Conformal coating and
CIL's engineers are able to look at each customer's application and help
specify a suitable material and process.
FULL BUILD CIL
is able to provide the full circuit design to box build manufacture service.
By using a combination of its Design / Rapid Prototype / Advanced Manufacturing
/ CEM / TEST departments it is able to offer the full spectrum of techniques
along with other assembly processes such as Ultrasonic welding and mechanical
assembly. All of these techniques are utilised along side the most modern
manufacturing equipment in the UK, where the majority of the equipment
has been purchased within the last 3 years. CIL believes that its SMT
placement, X-Ray inspection, Thru Hole PCB and Test facility is one of
the most modern facilities currently available. Most companies have good
web sites, but when you visit the facility it is disappointing, this is
not the case with CIL. All of these techniques are utilised alongside
system facilities such as Kanban, Faxban and Eban Web based stock supply
to enable CIL's customer to benefit from its engineers and technology.
