CIL - Custom Interconnect Ltd
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CIL - Custom Interconnect Ltd

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Contract Electronics Manufacturing
SMT Assembly
Hi speed Placement
Fine pitch SMT BGA / QFP's
Thru-Hole Assembly Selective Soldering
Wave Soldering Full Box Build TERADYNE ICT ATE
Flying probe ATE Functional Test
X-Ray Inspection BGA / QFP rework Ultrasonic Welding Potting
Conformal coating Full procurement ISO9001:2000

Advanced Manfacturing Technologies
Die bonding
Wire bonding Thick Film Hybrids Chip on Board MCM's Micropackaging MEM's
LED Encapsulation

Rapid Prototyping
Fast Turnaround Parts Procurement Design for manufacture Design for Test DFM / DFT

Product Design
In-house product design
H/W & S/W Design
PCB Design
CAD Design PADS PCB

Offshore Manufacture
High volume production in the Pacific rim linked through CIL's Design, prototyping and Production engineering departments

 
 
 

Tel +44(0)1264 321321 Fax +44(0)1264 321329 Email: sales@cil-uk.co.uk

PRODUCT DESIGN AND BUILD

With its Design for Manufacture / DFM service CIL provides a complete circuit and product design facility utilising Computer Aided Design / CAD for Printed Circuit Board / PCB design and Advanced Substrate Circuit design. Through our prototyping capability, this feeds into the CIL production facility which offers a full spread of capability including Surface Mount / SMT ; Ball Grid Array BGA ; unpackaged integrated circuits and all types of other devices including LED's; MEMS; Optoelectronics; Photonics; etc. In addition to PCBs we use Thick Film and LTCC technologies to give the optimum solutions in micro packaging. Our breadth of expertise and capability provides an outstanding facility to any company wishing to realise their electronic circuitry in the most cost effective way.

By using the CIL facility you get the best possible solution and reduced time to market with right first time design and prototyping using:-

A full design solution including:-

  • Circuit design using PADS PCB CAD inc SPICE simulation
  • Printed Circuit Board / PCB layout using CAD
  • Design for manufacture / DFM
  • Design for test / DFT
  • Project management
  • The use of expert third party resources from our excellent network of working contacts
  • Global component sourcing / procurement and design to minimise the chance of component obsolescence
  • Full product design including hardware and software
  • Lead free compliance

Prototyping including:-

  • Rapid sourcing of PCBs and components using our excellent network of world wide suppliers
  • Interactive production and testing of prototypes with you the customer
  • Fast turnaround

A full manufacturing service including:-

  • Advanced precision and high volume surface mount / SMT placement lines
  • Ball Grid Array / BGA and micro BGA / µBGA assembly
  • Semiconductor handling and packaging including die and wire bonding of all types.
  • Handling of all types of devices including LED's; MEMS; Optoelectronics; Photonics; etc.
  • Chip on Board / COB

A full testing and quality control service including:-

  • TAKAYA Flying probe testing
  • TERADYNE 1820 ICT ATE
  • DAGE XD7600 X-Ray inspection
  • EMC and other regulatory testing
  • Full ISO 9001:2000 approval

And all this from a growing company with an outstanding track record earned over many successful years in the industry.

 

 

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