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Contract Electronics Manufacturing
SMT Assembly
Hi speed Placement
Fine pitch SMT BGA / QFP's
Thru-Hole Assembly Selective Soldering
Wave Soldering Full Box Build TERADYNE ICT ATE
Flying probe ATE Functional Test
X-Ray Inspection BGA / QFP rework Ultrasonic Welding Potting
Conformal coating Full procurement ISO9001:2000

Advanced Manfacturing Technologies
Die bonding
Wire bonding Thick Film Hybrids Chip on Board MCM's Micropackaging MEM's
LED Encapsulation

Rapid Prototyping
Fast Turnaround Parts Procurement Design for manufacture Design for Test DFM / DFT

Product Design
In-house product design
H/W & S/W Design
PCB Design
CAD Design PADS PCB

Offshore Manufacture
High volume production in the Pacific rim linked through CIL's Design, prototyping and Production engineering departments

 
 
 

Tel +44(0)1264 321321 Fax +44(0)1264 321329 Email: sales@cil-uk.co.uk

NEWS

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UK's broadest electronics manufacturing capability all under one roof

CIL's move to a new manufacturing facility in Andover brings 'all under one roof' a truly remarkable range of electronics manufacturing capability.

cil facility - die bonding, wire bonding, bga assembly


The new 18,608ft² facility allows CIL to consolidate its design and manufacturing capability that was previously on two sites in Whitchurch and house COOLLED, a new company within the CIL group that was formed earlier this year to exploit the commercial potential of a new method of packaging LED arrays. The new factory is centrally placed being a few minutes walk from Andover railway station and a mile or so off the main A303 from London and provides facilities for:

Circuit and PCB design using VUTRAX and PADS PCB systems
Full procurement and/or part procurement and free issue
Two hi-speed automatic Die bonders
Three automatic Wire bonders using either Aluminium wedge or Gold Ball bonding techniques
Micropackaging / complex assembly facility using innovative assembly processes.
Optical and optoelectronic assembly LED / Laser / Photodiodes / optical die assembly
Thick film Hybrid capability
Three full automatic SMT lines for 0402 / 0603 components
QFP / FPGA
BGA's and uBGA assembly
BGA rework
X-ray inspection with DAGE XD7600
TAKAYA flying probe ATE
Thru-hole assembly including selective and wave soldering
Full box build
Conformal coating
Potting and ultrasonic welding
Toolroom and mechanical workshop facility

wire bonding, bga assembly, wire bonding

Managing director, John Boston explains the rationale behind the move saying: "We now offer a true 'one stop shop' electronics sub-contract design and manufacturing capability that provides in-house circuit design, CAD layout, prototyping, auto SMT, BGA, 0402, X-ray, die / wire bonding, flying probe test and much more.

"Over the past three years we have self-financed a major capital equipment investment programme of just over £1 million on new equipment. This provides us with one of the most up-to-date and comprehensive electronics manufacturing facilities in Europe and it is important that the whole process is integrated under one roof. The new building will also provide COOLLED with separate administration offices while sharing manufacturing facilities with CIL." .


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