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Contract Electronics Manufacturing
SMT Assembly
Hi speed Placement
Fine pitch SMT BGA / QFP's
Thru-Hole Assembly Selective Soldering
Wave Soldering Full Box Build TERADYNE ICT ATE
Flying probe ATE Functional Test
X-Ray Inspection BGA / QFP rework Ultrasonic Welding Potting
Conformal coating Full procurement ISO9001:2000

Advanced Manfacturing Technologies
Die bonding
Wire bonding Thick Film Hybrids Chip on Board MCM's Micropackaging MEM's
LED Encapsulation

Rapid Prototyping
Fast Turnaround Parts Procurement Design for manufacture Design for Test DFM / DFT

Product Design
In-house product design
H/W & S/W Design
PCB Design
CAD Design PADS PCB

Offshore Manufacture
High volume production in the Pacific rim linked through CIL's Design, prototyping and Production engineering departments

 
 

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Custom Interconnect expands SMT manufacturing

Custom Interconnect Limited (CIL), the Whitchurch based company that provides an expert contract electronics manufacture and design service, has once again reversed the recent trend of companies in the manufacturing industry cutting back on capital investment by undertaking a major expansion of its SMT manufacturing facility.

A new automated, in-line system incorporating a Tyco Meridian placement machine, a vision printer and a Tyco reflow oven has been installed in addition to the existing in-line Quad QSP2 multi-head and two stand-alone, single-headed machines already in use .

This new state-of-the-art facility provides increased placement accuracy and a greatly reduced defect rate. The system handles 0402 components with ease and both standard and micro ball grid arrays.

Nick Edwards, chief executive of CIL said: "This investment is part of our on-going development plan and was necessary to meet the increased demand for SMT production. The new machine allows us to set up cost-effective production runs in smaller batch sizes and runs longer batches at greater speed. This allows us to offer improved quality, greater production flexibility and faster turn rounds to our customers."

CIL, formed in 1987, provides a service that bridges the gap between design and manufacture and covers surface mount, chip on board and multi-chip fabrication.

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