Back to News main...
CIL expands die and wire bond capability
Whitchurch based electronics manufacturing and design company, CIL, has installed another new aluminium wire bonder that is designed to meet the demands of the latest techniques required in die and wire bonding.
The new ASM559A machine incorporates all the latest technology
and with a 60 deg wire feed is able to wire bond deep access applications.
John Boston, managing director at CIL, said: "It has been our
policy over the past two years to concentrate on niche areas where
"state of the art" wire bonding is required. Existing machines
of just a few years old just cannot cope with the accuracy required
when working with some modern die and the techniques used in applications
such as LED technology and ultra fine pitch, high wire bond count
applications.
"The field of opto electronics is becoming exceedingly important
to us. We are now designing, die bonding, wire bonding, encapsulating
and testing high-density LED die for this market and to remain
competitive it is vital to invest in the latest equipment. These
new wire bonders are capable of 3 wires per second on a 90um pitch
with up to 1000 off wires/device and this is opening opportunities
to CIL that other suppliers cannot compete with.
We now have an increasing number of customers who are using our
die bond, wire bond, micropackaging and full SMT build capability
on three brand new surface mount lines to develop and manufacture
very advanced products. These products are adding to our customer's
growth and also significantly contributing to our own."
This is the second new aluminium wire bonder that CIL has installed
in the past two years and the company plan to install a new automatic
gold ball bonder in the next 3 months. But before they do that,
in December 04 they are installing a DAGE XD7600 X-Ray inspection
system and upgrading their wire bond / die shear testing capability
with a DAGE Series 4000 bond tester.
Back to News main...