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Contract Electronics Manufacturing
SMT Assembly
Hi speed Placement
Fine pitch SMT BGA / QFP's
Thru-Hole Assembly Selective Soldering
Wave Soldering Full Box Build TERADYNE ICT ATE
Flying probe ATE Functional Test
X-Ray Inspection BGA / QFP rework Ultrasonic Welding Potting
Conformal coating Full procurement ISO9001:2000

Advanced Manfacturing Technologies
Die bonding
Wire bonding Thick Film Hybrids Chip on Board MCM's Micropackaging MEM's
LED Encapsulation

Rapid Prototyping
Fast Turnaround Parts Procurement Design for manufacture Design for Test DFM / DFT

Product Design
In-house product design
H/W & S/W Design
PCB Design
CAD Design PADS PCB

Offshore Manufacture
High volume production in the Pacific rim linked through CIL's Design, prototyping and Production engineering departments

 
 

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NEWS

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Another new SMT line to increase capability at CIL

CIL, the Whitchurch based electronics manufacturing and design company, has installed another completely new, fully automated surface mount line. This is the third new SMT line installed by CIL over the past 14 months.


The new in-line system incorporates a TYCO MIRAE1025P placement machine, a SPEEDPRINT SP880avi vision printer and a Tyco reflow oven that, as with all three new lines at CIL, can be used with lead free components.

John Boston, CIL managing director, said: "The type of work that is staying in the UK rather than going offshore involves complex boards where a higher degree of accuracy and improved repeatability is required. We are also seeing more and more applications using BGA and FPGA style packages.

The older type of SMT lines just cannot cope with this type of product and the reduced lead-times required by customers. We have invested £600K in SMT placement machinery recently but we are getting a healthy return on this investment from the amount of new work the increased capability is producing."


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