Back to News main...
CIL goes for gold in new factory in Andover
Gold ball bonding capability caters for new substrates.
Custom Interconnect Limited (CIL) has installed a new F&K Delvotec
Model 6200 high speed, hybrid gold ball bonder, the first addition
to the company's new manufacturing facility in Andover, Hampshire.
This latest investment by CIL is to cater for the growth in its
use of thick film ceramic, carbon fibre and other new exotic substrate
materials now being used in the electronics manufacturing industry.
CIL managing director, John Boston, explains: "The majority of
chip on board processing is carried out using aluminium wedge
bonding; in fact we have installed two new automatic aluminium
wire bonders recently at CIL. However, we are now being asked
to handle other substrate materials and, because of the difference
in the metallisation process both on the substrate and in some
instances on the die, Au ball bonding is the preferred solution.
This installation of this machine means that, together with our
new Al wedge bonders, we have a very advanced packaging facility
capable of bonding any substrate or die combination that is likely
to be required.
"In addition to CIL work we will also be able to use it in the
production of LED arrays for our associate company, COOLLED, where
not only are we now producing UV LED arrays but are about to launch
products using LEDs of many different wavelengths." The Delvotec
Model 6200 can handle five wire connections per second and with
a 35 micron pad pitch capability is ideal for ultra fine pitch
work on advanced ball grid arrays.
Back to News main...