CIL brings Flip Chip / WLCSP / Wafer / Interposer / BGA solder bumping to the UK for advanced semiconductor packaging

Following further investment in advanced packaging capability at its BP2 OSAT facility, CIL has brought on-line the UK’s first PacTech SB² – Jet solder ball laser reflow system. The SB² – Jet system is a three laser fully automatic balling system capable of attaching ball sizes ranging from 60um to 760um and up to 300mm wafer sizes. This will enable CIL to provide OSAT services for wafer, interposer, Flip Chip, WLCSP, CSP, PCB bumping through to BGA balling and re-balling.

As well as ball sizes from 60um to 760um, CIL will be offering advanced packaging ball attach using a selection of varying solder alloys for different market applications, these include

• SAC305           Standard RoHS alloy for most applications
• SAC405           Standard RoHS alloy for some applications
• SACQ               Offers superior fatigue resistance and improved board-level reliability over SAC405 or SAC305
• Tin / Lead       Defence, Mil Aero, Aerospace & Space requirement
• Bismuth          Medical & Biomedical devices

CIL’s WLCSP / Flip Chip packaging services will be engaged in wide-range of industry applications, including defence, aerospace, automotive, premium motorsport, commercial, communication, industrial power, 5G and RF and many more. They are suitable for numerous assembly and packaging applications, such as:

• Flip Chip Package on Package (FC PoP)
• 3D Integrated Circuit (IC)
• 5D Interposer
• Flip Chip
• Embedded Integrated Circuit (IC)
• Fan-Out Wafer Level Packaging (FO WLP)
• Wafer Level Chip Scale Packaging (WLCSP)
• Chip Scale Packaging (CSP)
• Ball Grid Array (BGA)
• Ball Grid Array re-balling
• Printed Circuit Board (PCB) balling

 The main process CIL is enabling in the UK is the manufacture of Flip Chip and WLCSP devices. These two devices are sometime confused, and they are defined as such

• Flip Chip - refers to bumps on semiconductor wafers which are in the range of 50 to 200 µm in height and are usually assembled using and underfill material between the die and the substrate
• WLCSP - refers to bumps that are in the range of 200 to 500 µm in height and are usually assembled without an underfill material

The SB² – Jet is the flagship platform of PacTech’s leading edge solder jetting technology with the high precision gantry is the most advanced system for automated high-speed sequential solder ball attach and laser reflow. With accurate, precise and reliable performance proven in mass volume production environment, the large working area of this model is highly flexible for a variety of different microelectronic substrates and applications. CIL’s comprehensive version of the SB² – Jet is complete with a vision and pattern-recognition system, an after-bump 2D inspection and an additional repair unit, wafer handling solution customizable to support customer-specific products and carriers such as conveyor, robot or reel-to-reel system, this machine is ready for in-line production integration.

To enable the UK / EU semiconductor community to gain access to advanced packaging technology, the CIL SB² – Jet system is the fully upgraded system which includes

• Ball Inspection System (2-D)
• Automatic Z-Height Measurement by both N2 pressure and laser sensor
• ESD Kit
• Heated chuck/work stage
• Specific heated work holder for BGA-like devices
• Solder Ball Rework Station
• Wafer Handling System - 300mm / 12”
• Specific heated work holder for BGA-like devices
• Expand working area > 320x320mm

The addition of the SB² – Jet now further expands CIL’s semiconductor packaging OSAT services, which now covers

• SiC Power module design and manufacture up to 1000A / 1000V
• GaN Power module design and manufacture
• Microelectronic package design and manufacture using fine wire bonding for Silicon (Si) and RF MMIC devices
• Custom package design
• Wafer bumping – 60um to 760um up to 300mm
• Wafer dicing – up to 300mm
• Die bonding using epoxy, eutectic solder and silver sintering
• Sintering – Die and high current busbar attachment
• Wire bonding – Au Ball, Au Wedge, Al Wedge, Au Ribbon & Heavy gauge Al Wedge
• WLCSP and interposers
• Encapsulation including glob top, Dam & Fill glob top, overmold and open cavity overmold
• Laser marking
• Device separation
• Device Test including double pulse test of SiC & GaN power modules
• PCBA Prototyping
• Small to medium volume PCBA Assembly and test – 3 SMT lines
• Volume PCBA Assembly and test – 4 SMT lines
• X-Ray, CT Scan, CSAM and CMM inspection and measurement all in-house
• Box build of complete product 

If you’re interested in our advanced technologies, get in touch with the business development team today and see what Custom Interconnect can do for you.