CIL has commenced the build out of Stage 3 development at its BP2 OSAT facility in Hampshire UK

Following significant contract wins for its Semiconductor packaging OSAT services and complex PCBA manufacture, CIL has commenced construction of the next stage of the BP2 facility in Hampshire. This extended assembly area is due to be on-line by June 2026 and will provide the manufacturing area for CIL's next  stage of growth.

Since 2021, CIL has trebled in turnover, with a planned turnover in this financial year of £45M and similar planned growth in the next financial year. This growth has resulted in CIL committing to further expanding its manufacturing floor space. There are a total of 5 stages within the BP2 facility, they are

Stage 1 finished in June 2023, was the creation of the UK’s largest semiconductor packaging facility which is still expanding and offering increasingly complex OSAT services. This entire ISO7 area houses the following equipment.

• 1 off DISCO DAD3361 die and device wafer saw system and associated wafer mounting equipment
• 1 off PacTech SB2+ solder balling system 
• 3 off DATACON 2200EVO Auto diebonders 
• 2 off HACKER Auto die bonders
• 2 off Manual die bonders
• 6 off ASM 589 Auto Al wedge bonders
• 2 off ASM EAGLE60 Auto Au Ball bonders
• 1 off K&S ASTERION Heavy Gauge Wedge wire bonder
• 1 off DAGE 4000 die shear/wire bond pull tester
• 1 off DAGE Prospector die shear/wire bond pull and full diagnostic test system
• 4 off Nordson Asymtek S2-920 Auto dispense / Glob top systems
• 1 off Nordson GEN7 Scanning Acoustic Microscope (CSAM)
• 1 off ATV SRO-700 Formic Acid / Vacuum soldering system
• 1 off Boschman Sinterstar Innovate F-XL sinter press for silver sintering
• 1 off Boschman Pre-heat and cooling tower system for silver sintering
• 1 off Boschman UNISTAR Auto plastic overmold machine. This is capable of over-moulding BGA’s, LGA’s, QFN’s, Plastic IC’s, Power discrete.
• 1 off Laser marking system
• 1 off Loadpoint dicing system for QFN device separation
• 1 off Scheugenpflug VDS U1000 / LP804 VDU Auto epoxy fill system
• 1 off Keyence VHX7000 Digital Microscope with sub-micron laser measurement
• 4 off Keyence laser measurement systems, for die / product in-line measurement and product compliance

This equipment is used for OSAT Semiconductor packaging in the following technologies

• SiC Power module design and manufacture up to 1000A / 1000V
• GaN Power module design and manufacture
• Microelectronic package design and manufacture using fine wire bonding for Silicon (Si) and RF MMIC devices
• Wafer bumping
• Wafer dicing
• Die bonding
• Sintering
• Wire bonding
• WLCSP and interposers
• Encapsulation including glob top, selective glob top, overmold and open cavity overmold
• Device Test including double pulse test of SiC & GaN power modules
• PCBA Prototyping
• Small to medium volume PCBA Assembly and test
• Volume PCBA Assembly and test
• X-Ray, CT Scan, CSAM and CMM inspection and measurement all in-house

                                                                                              Stage 1 Semiconductor packaging ISO7 cleanroom

Stage 2 finished in December 2024 houses four SMT lines and associated inspection and test equipment for advanced PCBA manufacture and test. This is to support the OSAT requirement and CIL’s customers of highly complex PCBA manufactured in volume. It currently houses four full auto SMT lines all with in-line 3D AOI, all running assemblies using 0201 passives and multi BGA / WLCSP devices. Once stage 3 is finished, this stage 2 area will have the ability to increase the SMT lines from four to six lines. This current area currently houses the following equipment

• 4 off DEK NeoHorizon 03iX Solder printers
• 4 off MYCRONIC MY300DX SMT Placement machines with built in component test for component level traceability
• 4 off Vitronics 10 zone Reflow Ovens
• 4 off Koh Young ALPHA HS 3D AOI Inspection
• Multiple Auto-load /Auto-unload / Flip conveyors for “hands off” production
• 1 off TAKAYA APT2400F Flying probe tester
• 1 off DAGE QUADRA 7 Pro X-Ray & CT Scan inspection system
• 1 off NC25 PCB Cleaner
• 1 off Cencorp SR1300 PCB Automatic Router
• 6 off N2 Storage cabinets
• 8 off ATE test stations
• Offline SMT kitting area

                                                                                       Stage 2 Volume PCBA assembly / inspection / test facility 

Stage 3 planned to be complete and ready for occupation in late June 2026. This is another fully environmentally and static discharge controlled area for further company expansion.

                                                                                                Stage 3 Volume OSAT & PCBA inspection / test / build area

Stage 4 & Stage 5 are areas within the BP2 facility that can be constructed and fitted out to further support CIL’s customers when the needs for further expansion arise.

In addition to the manufacturing area expansion, a number of new assembly equipment purchases and processes will come on-line shortly and CIL will be releasing more news in the coming months. CIL would like to thank not only its customers, but all of its stakeholders for its on going success bringing world class design, development and manufacture of Semiconductor packaging and complex PCBA manufacture to the UK.

If you have an interest in OSAT or complex PCBA manufacture, please visit our contact page and we will be in contact.