CIL wins "Excellence in Innovation" at the National Electronics Industry Awards :: Custom Interconnect Limited

CIL wins "Excellence in Innovation" at the National Electronics Industry Awards

CIL are proud to announce they won the "Excellence in Innovation" at the National Electronics Industry Awards. This was in recognition for their work on Net Zero electronic solutions using WBG devices such as SiC and GaN and creating the UK's largest Semiconductor Packaging facility. A huge thank you to all who voted for us and congratulations to all the winners and shortlisted companies.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 Held at the Grand Connaught Rooms in Covent Garden, London, the Gala Dinner event brings together the UK's Electronics industry to celebrate the achievements of the last 12 months. CIL was shortlisted against some industry giants that included 

  • Infineon Technologies AG
  • Panasonic Industry Europe
  • Renesas Electronics
  • SECO and NXP

CIL was also shortlisted for "Manufacturer of the Year", but this year it was unsuccessful and after not getting awarded "Highly Commended" for "Excellence in Innovation" its last entry, thought it was going home empty handed considering it was up against some industry giants. But a combination of public voting and the awards judges resulted in CIL's name being called out as the winner on the night.

 

 

 

 

 

 

 

 

 

 

CIL's entry for this award is pasted below

As well as innovating for our on-going EMS customers, CIL has increased its Net Zero DER / APC / InnovateUK projects from two to nine. They are as diverse as Automotive SiC BEV, EV Charging, Drone eVTOL charging, web hub GaN PSU’s, 5G RF packaging, Aerospace and power generation projects. These projects and their subsequent production demand has required CIL to increase its engineering staff from 8 persons 4 years ago, to 50 persons today with a further 5 persons planned in the next 12 months. Also, it has had to increase its manufacturing capacity from 34,000sq ft to 100,000sq ft all in Andover UK.

As well as the Net Zero low carbon projects, it has also been working with its customers on their very latest designs. This has resulted in CIL upgrading nearly all of its manufacturing equipment in the last 3 years and adding multiple other processes and automated equipment. So, CIL is now innovating new technology in 3 distinct market sectors

  • CEM/EMS provider of low – medium and volume complex PCBA
  • Semiconductor packaging - die bonding, wire bonding and encapsulation
  • SiC & GaN power module/discrete device/Power PCBA development and low – medium volume production

Starting in late 2019, CIL was approached by BMW to join its APC15@FutureBEV consortium to develop BMW's next generation of SiC Power modules and associated power PCBA for their future BEV systems. The APC15@FutureBEV project and publicity generated from it resulted in CIL finding itself now working on a total of 9 InnovateUK / APC / DER zero carbon projects which total £65M and CIL’s total project values are £8M. The 9 projects are in diverse low emission markets such as

  • Automotive BEV (3 projects)
  • BEV charging
  • eVTOL vehicle systems and charging
  • 5G RF MMIC packaging
  • GaN PSU systems for web server hubs
  • GaN PSU systems for very high efficiency power switching
  • UK supply chain for high power PCB’s and AMB substrates

The success of the APC15@FutureBEV project and CIL’s association with BMW and other project partners has transformed CIL’s offering. With a total of 9 InnovateUK / DER / APC / DCMS projects now running simultaneously and further multiple projects from customers have approached CIL directly, CIL has now created the largest Semiconductor packaging and power device assembly facility in the UK. The 9 InnovateUK projects with more planned will enable to CIL to become the number one Power Electronics facility in the UK. Furthermore, CIL are working with 3 Catapults and the Universities of Warwick, Cardiff, Swansea, Bristol, Nottingham, Newcastle, Imperial College London. All of this has been achieved from a standing start on the InnovateUK projects 36 months ago.

All of the above has necessitated CIL making the decision 24 months ago to commit to increasing its Andover UK manufacturing facility from 34,000sq ft to 100,000sq ft. The new BP2 building totalling 64,000sq ft came on-line in Q2 2023 and houses a 15,000sq ft ISO7 Class 10,000 cleanroom for product development and subsequent full production and a further 15,000sq ft volume PCBA manufacturing facility.

Some processes are existing UK available technology, but funding from the projects is bringing online Power module/discrete device and Power PCBA technology that will not be found anywhere else in the UK. In the last 2-3 years and in the upcoming 4-5 months, CIL will have installed, commissioned

  • 7 off Solder printers, 5 off SMT placement, 5 off 10 zone reflow ovens
  • 1 off Vacuum Assisted Vapour phase reflow for power device soldering
  • 1 off Vacuum assisted N2 10 zone reflow for volume production
  • 2 off 3D Automatic Inspection systems
  • 2 off TAKAYA APT1400F flying probe – 2 older systems phased out
  • 2 off X-Ray Digital X-ray/ CT Scan
  • 1 off Auto Laser PCBA de-paneller
  • 2 off Auto Mechanical CNC PCBA de-paneller
  • 3 off Auto die placement machines – 2 off existing - 5 off total
  • 5 off Auto wire bonders – 3 off existing - 8 off total
  • 4 off Auto epoxy encapsulation machines
  • 1 off Auto high-pressure Silver Sinter press for SiC die attach
  • 1 off Auto Heavy gauge wire bonder for SiC power module/discrete device assembly
  • 1 off Scanning Acoustic Microscope (CSAM) for power device inspection
  • 1 off Auto Plastic Overmold capability for SiC & GaN modules and QFN packaging
  • 1 off Auto Semiconductor dicing saw for SiC / GaN / Si wafer dicing

The use of InnovateUK monies and CIL investment has meant we have created the largest semiconductor packaging facility in the UK and are recruiting and training the next generation of young engineers to drive it forwards. The engineering department to support this has grown from 8 persons 3 years ago to 44 persons to date with a further 8 engineers planned in the next 12 months. We have recruited 9 graduates from universities in the last 24 months, with 3 more planned.

Changes to existing staff, Graduate recruitment and retention planning, PhD sponsorship, Cell leads, internal and external training courses, diversity and equality were all looked at it in detail.


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