Device / module ATE test

CIL provides complete production test hardware and software solutions for multiple platforms. We have an experienced team of test development engineers who can engineer Final Test and Wafer probe solutions for RF/Mixed signal/HV and high-speed digital products. This test capability is covered by two advanced ATE systems installed at CIL's BP2 OSAT facility, they are

• CHROMA 3650-S2 Power device / module ATE system 
• CHROMA 3680       Mixed signal SOC/RF test ATE system

The Chroma 3650-S2 platform has many differentiating characteristics and has been selected to support testing of Power discrete products, DC-DC converters, PMIC, and a range of other power and small Analog and Mixed signal components. The tester is unique in that it can supply isolated, stackable, or ganged resources to support testing at several kV's and 100's of amps. This is a platform designed for Power testing and to support high-throughput parallel test solutions. 

• Architecture: Features 12 universal slots customizable for digital, analog, and mixed-signal test options.
• Pin Capacity: Accommodates up to 768 digital I/O and analog pins.
• Speed Performance: Delivers a 50/100 MHz clock rate alongside a multiplexed (MUX) data rate of 100/200 Mbps.
• Signal Precision: Achieves an Edge Placement Accuracy (EPA) of ±300ps.
• Memory Capacity: Provides 32 MW vector memory and 32 MW pattern instruction memory. 

• High Power Supplies: Supports extreme configurations up to 3000V or 160A per channel, stretching up to 3750V or 320A using specialized setups.
• Per-Pin Resources: Built with per-pin Parametric Measurement Units (PPMU) and dedicated frequency measurement.
• Versatile VI Boards: Utilizes high-density, high precision instrument boards such as HDDPS2, HVVI (High Voltage VI), VI45, PVI100, and MPVI

The Chroma 3680 platform provides flexible configurations and wide coverages to compatibly test different types of devices. The system is flexible to deploy the conflagration up to 2048 pins within 24 universal slots with the digital performance up to 1Gbps, the largest default 256MW vector memory, ±150ps EPA for superior timing accuracy in high speed application, and provides various options such as HDADDA2 for converter test, HDVI for high voltage & automotive, HDAVO for performance mixsignal with video applications of 400Msps AWG & 250Msps DIG and another high precision audio application of 24bit AWG & DIG. The 3680 also includes mainframe cabinet containing AC, DC power distribution unit and system power supply. An optional test head manipulator is offered for docking with automated device handing equipment. The system is specifically designed for high throughput and high parallel testing capability to provide the best solution for fabless, IDM and testing houses. With full functions of test capability, high accuracy, powerful software,and excellent reliability, the 3680 is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices. The Chroma 3680 is an Advanced System-on-Chip (SoC) Test System is a high-precision Automatic Test Equipment (ATE) platform designed to handle the complex, high-mix, and high-speed testing requirements of modern semiconductor chips, particularly those used in Artificial Intelligence (AI), Edge AI, IoT communication, and automotive applications.

• Digital I/O Channels: Configurable up to 2,048 digital pins across 24 universal slots.
• Data Rate: Speeds reaching up to 1 Gbps.
• Vector Memory: Up to 16G SCAN vector storage depth to handle dense, massive AI testing patterns.
• Parallel Testing: Supports highly parallel testing layouts capable of running up to 2,048 sites concurrently.
• Timing Accuracy: ±150 ps Edge Placement Accuracy (EPA) for high-speed signal validation.

• HDRF2 / HDRF3 RF Boards: Features up to 32 RF ports and 4 Vector Signal Transceivers (VSTs) for direct-mount, cabling-free testing of Bluetooth, Wi-Fi 6/7, and 5G signals up to the 30 GHz millimeter-wave band. 
• HDAVO Module: Specifically designed for mixed-signal and video applications, incorporating high-precision 400 Msps Arbitrary Waveform Generators (AWG) and 250 Msps Digitizers.
• Power & Parametric Units: Integrated Device Power Supplies (DPS) and Parametric Measurement Units (PMU) optimized for power management ICs (PMICs) and automotive high-voltage checks.

When you consider that CIL compliments this with Automatic Wire Bonding and our extensive SMT & test capabilities, CIL can offer a total product solution.

Get in touch with our Business Development team, and arrange a visit to meet the CIL Advanced Technology Group in order to explore applications and manufacturing methods available.