Flip Chip

Essentially, the name “Flip Chip” describes the method used to connect a semiconductor die to a substrate: The dies are bumped and then “flipped” onto a substrate, hence the name “Flip Chip”.

Flip Chip package technology offer a range of benefits including:

• High pin count
• High signal density
• Better power dissipation
• Low signal inductance, and good power/ground connectivity.
• Ideal for high speed interfaces (including RF) that wire bonds cannot suppor

Flip Chip substrate is in essence a small Printed Circuit Board (PCB) located inside the package.

• Substrate design consists of layout of all signals from the package external balls to the bumped internal pads. It is because of a more direct path on the substrate (as illustrated below) that gives flip chip some of its advantages
• Substrates can be made by different PCB materials: laminate, build-up, ceramic, and more. Substrate layout design rules vary from different suppliers.
• Substrates can consist of many layers ranging from 2-18 layers to allow proper routing of all signals for enhanced device performance

 In order for the chip to be connected or mounted to a substrate, the die is turned or flipped over and brought into alignment with the pads located on the substrate. There are six (6) key process steps:  Fluxing, Placement, Reflow, Flux Cleaning, Capillary Underfill, and Cure.

 Feel free to get in touch with our Advanced Technology Team and have a conversation regarding your particular requirements.