Wafer Dicing
Semiconductor dicing and die preparation are essential and intricate steps in the semiconductor fabrication process. These steps are crucial for ensuring that individual chips, also known as dies, are meticulously separated from the wafer and adequately prepared for the subsequent stages of final packaging. The precision and care taken during these processes are paramount, as they directly influence the overall yield, performance, and reliability of the final semiconductor devices. A well-executed dicing and die preparation phase can lead to higher quality and more efficient semiconductor products, which are vital for meeting the demanding standards of modern electronic applications. This phase involves a series of detailed procedures that must be carefully managed to prevent defects and ensure that each die meets the necessary specifications for its intended use.
CIL has the capability for Wafer saw of substrates up to 300mm diameter using its DISCO 3361 Semi-automatic dicing system. CIL's DISCO 3361 system has been installed with all of the water treatment and purification sub-systems to support multiple wafer types such as Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Glass and Ceramics.
The wafer dicing equipment is all housed within CIL's ISO7 Semiconductor packaging facility and utilises specialist LED lighting for the control of UV sensitive processes.
Die prep encompasses all processes that take an IC from a wafer after test and into die form prior to assembly. The primary die prep steps are:
- Wafer Mounting
- Wafer Backgrinding or Thinning (This is subcontracted service)
- Wafer Cleaning
- Wafer Dicing (Singulation)
- Die Inspection
- Die Sorting & Picking
- Die Bonding (if part of the process)
Get in contact with a member of our friendly sales team for more information on our wire bonding capabilities today.
Why work with CIL?
As part of a Product Technical Review, we can assist our customers by providing you with design proposals detailing appropriate substrates; advise on the choice of materials and finishes; wire sizes and types. Our Project Management and Engineering Team have the requisite experience and knowledge to help and assist you with this process.
Furthermore, when combined with our die bonding and extensive SMT & test capabilities, CIL can offer a total product solution.
Get in contact with a member of our friendly sales team for more information on our wire bonding capabilities today.
