Surface Mount Assembly
We have 6 fully independent Surface Mount Assembly Lines within our main Electronics Facility and 4 in line solder printers as well as MY500 ink jet solder print capability. The six SMT lines comprise a total of 10 individual placement machines, providing an theoritical capability in excess of 220,000 placements an hour. All SMT lines are equipped with Automated Solder Paste screen print and Multi-Zone Re-Flow soldering. At CIL we provide one of the UK's most technically capable and flexible electronics manufacturing resources available.
In addition to the traditional automated Solder Paste Printing, and in consideration for the more specialised application of Solder Paste, we have available, Direct Solder Jet Printing using the very latest MY500 ink jet print technology from Mydata. This flexible system enables us to be printing solder directly to product in under 30 minutes, with no stencil or special tooling required. The direct printing process provides for significant benefits in the NPI Process, and at early model production. This system allows for in-process adjustments to be made, especially when there is a need to remove or add additional solder paste during a pre-production run. These adjustments are simply not possible when using traditional solder paste screens. Direct Solder Printing is a lower cost and incredibly flexible solution...
PCB substrate material used include• FR4 ALL THICKNESSES AND FR4 Hi TEMPERATURE• NELCO / ISOLA / ROGER’s / TACONIC FOR RF CIRCUITS • RT / DUROID / RO4350B FOR uW CIRCUITS TO 70 GHz • POLYIMIDE FOR HIGH TEMPERATURE CIRCUITS OPERATING AT 150/175 Deg C• SPECIAL PCB MATERIAL FOR VERY HIGH TEMPERATURE CIRCUITS >220 Deg C • NON – MAGNETIC POLYIMIDE • POLYIMIDE AND POLYESTER FLEX• FLEX RIGIDS• CERAMIC – ALUMINA & ALUMINIUM NITRIDE • ALUMINIUM, ALUMINIUM CLAD & COPPER CLAD PCB’s
Our vast technical capability allows for placement of 01005 Chip components up to the larger devices, and CIL's SMT department is placing 0201 and 0402 devices in volume every day. This, coupled with our extensive experience of working with bare silicon die, means we are handling and placing many new styles of wafer scale and chip scale packages, with frequent regularity. Take a look at our Advanced Technology section where we demonstrate how, at CIL, we can design and manufacture BGA's as well as just placing them.
Reflow Soldering is achieved using our multi-zone forced air reflow systems and we can also provide re-flow soldering within a Nitrogen/ N2 Environment, used across the high reliability and mission critical sectors. Our Engineering and Quality Assurance Teams, in conjunction with our Customers, have selected a number of high reliability solder pastes which are proven to be fully compatible with all of our post soldering processes, and fully conform to the requirements of both clean, or no-clean solder flux technologies.
We have a very impressive Surface Mount resource at CIL which provides the flexibility and adaptability required by our Customers, from very low volume, highly complex assemblies to simpler boards in high volume. With the total resource we have available, quantity and complexity is simply no barrier to Custom Interconnect Limited.