BGA Rework

BGAs (Ball Grid Arrays) are crucial components for high-performance PCBs, as they can accommodate a high number of connections in a very compact space, making them a must-have for high-performance integrated circuits.

Ball grid arrays are a type of package for an IC (integrated circuit), and this packaged IC is then mounted on the PCB.

Our BGA Rework Capabilities

Custom Interconnect Limited can rework and/or replace BGA’s and most other components with hidden or discrete leads. Our skilled operators and the support equipment we have available, such as BGA Rework Stations, Thermal Imaging Systems and of course Digital X-Ray, ensures that the best care and attention is always taken. Our rework staff are highly experienced and trained specialists to IPC Standards 7711/7721.

In addition to BGA exchange we do have the ability to re-ball BGA’s, but irrespective of what appears to be a simple replacement or re-balling, we would like to take each requirement and fully assess the risks involved, agreeing a technical instruction in consultation with our Engineering and Production Teams.

Product modifications and upgrades can be accommodated, from simple component removal and replacement, to bare board track modifications and wire linking, all conforming to the appropriate IPC Standards of methods and workmanship.

What is a BGA rework?

A BGA rework is the process of repairing or replacing a defective BGA. As BGA’s often belong to high-performance PCBs, it is usually cheaper to go through the meticulous process of repairing them, rather than buying a brand-new PCB.

What steps are involved in a BGA rework?

The process of a BGA rework varies from time to time. Typically there are 4 key steps involved in the process:

Inspection/diagnosis – The identification of the faulty BGA component through either a visual inspection, electrical testing, and/or X-ray inspection
BGA Removal – The removal of the faulty BGA component, usually done at a rework station
Preparation – Cleaning to remove any excess solder from the previous component
BGA Replacement – Placing the new BGA component onto the PCB