Wire Bonding
CIL offers the complete range of wire bonding techniques used in Semiconductor packaging. Our packaging facility offers cost effective, automated solutions that can produce as many as 100,000 assemblies per month or single devices. Our wire bonding capabilities include:
- Aluminium wedge bonding
- Gold wedge bonding
- Gold Ball bonding
- Heavy Gauge wire bonding in Aluminium and Copper wire/ribbon for power devices such as IGBT / SiC / GaN for the BEV & PHEV Automotive and other power markets.
We also produce assemblies that require reverse bonding for low loop profiles, die to die bonding and deep access wire bonding in a package to different heights. Our device types range from die having a single bond wire up to 750 wires / die. In some instances on COB devices we offer die bonding up to 1000 wires / assembly.
We recommend considering this resource in conjunction with our Die Bonding capability.
How does the wire bonding process work?
Wire thicknesses most commonly used are 17um, 25um and 32um dependent upon the bond pad sizes available and the wire types specified.
All our processes require strict controls exercised over the materials used, and the operational stability of the equipment itself. We maintain our quality and verify which materials are used using our in-house Dage PROSPECTOR Die Shear & Wire Pull Testing Station.
Our Wire Bonding Facility is housed within the BP2 Semiconductor packaging facility, the largest of its kind in the UK. We also have an in-house Plasma Clean not only to pre clean assemblies, but to wire bond with a number of substrates.
- FR4 Laminate COB
- Flex-rigids
- Alumina or other Metallised ceramics.
- DBC / AMB / AiN substrates
- Ceramic packages and lidding for component obsolescence and high temperature requirements
- Carbon Fibre and Steel.
- Aluminium Backed & Direct Bonded Copper.
- Thick Film & Thin Film.
- Polyimide rigid and flexible circuits.
- RT / DUROID / RO4350B circuits up to 40GHz
Maintaining product quality during process handling is very important, and we specify and use the variety of finishes and encapsulations above to maintain product integrity and security. In conjunction with our partners, we are able to select and offer a full materials analysis and provide reports of findings in order that appropriate further selections can be made.
All of our die bonding is inspected using our Dage Quadra5 X-Ray for die attach coverage and voiding. We will soon be adding a Scanning Acoustic Microscopy C-SAM for voiding under high power devices under very heavy/dense substrate materials such as thick copper, which cannot be inspected using X-Ray.
Applications of our wire bonding
The applications of our wire bonding can be found throughout every industry - our assemblies are used in markets such as:
- Medical sensors
- SiC power devices
- GaN power devices
- IGBT power devices
- Positional sensors
- X-Ray sensors
- Gas sensors
- RF MMIC QFN Devices
- X-Ray imaging sensors
- 40 GHz microwave power amplifiers
- LED modules
- Laser modules
- IOT sensors
- Automotive sensors
Why work with CIL?
As part of a Product Technical Review, we can assist our customers by providing you with design proposals detailing appropriate substrates; advise on the choice of materials and finishes; wire sizes and types. Our Project Management and Engineering Team have the requisite experience and knowledge to help and assist you with this process.
Furthermore, when combined with our die bonding and extensive SMT & test capabilities, CIL can offer a total product solution.
Get in contact with a member of our friendly sales team for more information on our wire bonding capabilities today.
