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Automotive BEV & PHEV

At Custom Interconnect Limited we have an unrivalled assembly capability to anywhere in the UK. With an extensive SMT PCB assembly facility, a state of the art high power die and wire bond assembly facility and a rapidly growing diagnostic equipment portfolio, our power electronics boast high quality production and superior technology for your battery engine vehicles (BEV) and plug-in hybrid electric vehicles (PHEV).

Our Power Electronic Packaging Capabilities

Our current manufacturing capabilities for BEV and PHEV include the following:

8 off SMT lines, all 01005 / BGA / WLCSP capable
10 zone hot air reflow, reflow in N2, In-line 10 zone hot air with Vacuum assist and vapour phase / vacuum assisted vapour phase
3d AOI with 15um resolution / measure / foreign object all set to IPC3
Dage QUADRA 5 x-ray system complete with CT-Scan capability for void analysis
Sonoscan GEN7 scanning acoustic microscopy (C-SAM) for void analysis of heavy copper content substrates
Laser depanel / cutter for odd form / thin / thick PCBs
FR4 heavy copper to 6oz, 8oz, 10oz, 16oz and 32oz
Silver sinter die attach of SiC / GaN devices onto multiple substrate types
Heavy gauge Aluminium / Copper wire bonding
Packaged IGBT / SiC / GaN power device soldering will very low levels of voiding <1%
Prototype capability of silver sinter die attach of SiC / GaN device
Prototype capability of heavy gauge aluminium / copper wire / ribbon bonding

Furthermore, we are able to provide the below:

Interconnect Technologies include:

Silver Sinter die attach
Silver Sinter top level interconnect
Silver Sinter both low/pressure-less and High Pressure methods
Eutectic Soldering using Formic Acid soldering techniques
Laser Soldering

Packaged SiC types include

ST Micro STPAK
ST Micro SCTG011H75G3AG
Wolfspeed WM4
ON SEMI
Hitachi
Multiple other packaged types

Die types include:

Silicon Carbide SiC
Gallium Nitride GaN
IGBT
Mosfet's
Multiple other die types

Substrate materials include:

Alumina or other Metallised ceramics.
DBC Direct Bonded Copper substrates
AMB Active Metal Brazing substrates
AiN substrates
Copper
Copper Tungsten
Aluminium Backed & Aluminium
Other high thermal materials

Heavy Gauge Wire Bonding includes:

Aluminium (Al) to 600um wire
Aluminium (Al) to 2.00mm ribbon
Copper to (Cu) 600um wire
Copper to (Cu) 2.00mm ribbon
Aluminium/Copper (AlCu) to 600um wire
Aluminium/Copper (AlCu) to 2.00mm ribbon

Our experience with BEV and PHEV vehicles

CIL has extensive knowledge and manufacturing experience in Automotive BEV & PHEV Electronic systems. Using ruggedised knowhow gained from 15 years of Oil & Gas PCBA production and our Advanced Technology excellence dealing with bare die processing, we create state of the art components for both BEV and PHEV vehicles. Our heavy gauge aluminium / copper wire bonding similarly give CIL un-rivalled BEV & PHEV manufacturing capability.

CIL is at the forefront of Silicon Carbide (SiC) and Gallium Nitride (GaN) packaging using silver sinter technology onto high thermal transfer materials such as AMB / DBC substrates and other materials. For top level interconnects, heavy gauge wire bonding using both aluminium or copper wire / ribbon is the preferred method, but other interconnect technologies are being researched. In the future we hope to offer the following capabilities:

Small, medium and volume capability of silver sinter die attach of SiC / GaN devices onto multiple substrate types
Small, medium and volume capability of heavy gauge aluminium / copper wire bonding
Volume SMT line for production manufacture of BEV inverter PCBA
Full suite of ESS equipment for automotive qualification
Complete BEV inverter assembly facility to 800v operation

Our expertise and knowledge have ultimately culminated in being selected by both BMW and McLaren on the APC15 funded @FutureBEV consortium, to develop SiC based power switches and associated drive electronics/sensors for BMW and McLaren inverters to be used on their future vehicles. We also work with a number of other customers in this sector using IGBT / SiC / GaN based power electronics coupled with heavy copper PCB's capable of operating at 150ºC and high vibration environments.