Automotive BEV & PHEV Systems

CIL has extensive knowledge and manufacturing experience of Automotive BEV & PHEV Electronic systems using ruggedised knowhow gained from 15 years of Oil & Gas PCBA production. This coupled with CIL's Advanced Technology excellence dealing with bare die processing and Heavy gauge Aluminium / Copper wire bonding gives CIL un-rivalled BEV & PHEV manufacturing capability. CIL is at the forefront of Silicon Carbide SiC and Gallium Nitride GaN packaging using Silver Sinter technology onto high thermal transfer materials such as AMB / DBC substrates and other exotic materials. For top level interconnect, Heavy gauge wire bonding using both Aluminium or Copper wire / ribbon is the preferred method, but other interconnect technologies are being researched. This has ultimately culminated in CIL being selected by both BMW and McLaren on the APC15 funded @FutureBEV consortium, to develop SiC based power switches and associated drive electronics/sensors for BMW and McLaren inverters to be used on their future vehicles. CIL is also working with a number of other customers in this sector using IGBT / SiC / GaN based power electronics coupled with heavy copper PCB's capable of operating at 150ºC and high vibration enviroment's

 CURRENT MANUFACTURING CAPABILITIES FOR BEV / PHEV SYSTEMS

6 off SMT LINES, 3 off 01005 CAPABLE AND 3 off 0402 CAPABLE

10 ZONE HOT AIR REFLOW, REFLOW IN N2, VAPOUR PHASE AND VACUUM ASSISTED VAPOUR PHASE

3D AOI WITH 15um RESOLUTION / MEASURE / FOREIGN OBJECT ALL SET TO IPC3

DAGE QUADRA 5 X-RAY SYSTEM COMPLETE WITH CT-SCAN CAPABILITY FOR VOID ANALYSIS

SONOSCAN Gen7 SCANNING ACOUSTIC MICROSCOPY (C-SAM) FOR VOID ANALYSIS OF HEAVY COPPPER CONTENT SUBSTRATES

LASER DEPANEL / CUTTER FOR ODD FORM / THIN / THICK PCB’s

FR4 HEAVY COPPER TO 6oz, 8oz, 10oz & 12oz

SMALL CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICES ONTO MULTIPLE SUBSTRATE TYPES

SMALL CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE BONDING

PACKAGED IGBT / SiC / GaN POWER DEVICE SOLDERING WILL VERY LOW LEVELS OF VOIDING

PROTOTYPE CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICE

PROTOTYPE CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE / RIBBON BONDING

FUTURE MANUFACTURING CAPABILITIES FOR BEV / PHEV SYSTEMS

SMALL, MEDIUM AND VOLUME CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICES ONTO MULTIPLE SUBSTRATE TYPES

SMALL, MEDIUM AND VOLUME CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE BONDING

VOLUME SMT LINE FOR PRODUCTION MANUFACTURE OF BEV INVERTER PCBA

FULL SUITE OF ESS EQUIPMENT FOR AUTOMOTIVE QUALIFICATION

COMPLETE BEV INVERTER ASSEMBLY FACILITY TO 800v OPERATION

Get in touch with Custom Interconnect today and learn how our industry leading team can help your Automotive BEV & PHEV needs.