Automotive BEV & PHEV Systems
CIL has extensive knowledge and manufacturing experience of Automotive BEV & PHEV Electronic systems using ruggedised knowhow gained from 15 years of Oil & Gas PCBA production. This coupled with CIL's Advanced Technology excellence dealing with bare die processing and Heavy gauge Aluminium / Copper wire bonding gives CIL un-rivalled BEV & PHEV manufacturing capability. CIL is at the forefront of Silicon Carbide SiC and Gallium Nitride GaN packaging using Silver Sinter technology onto high thermal transfer materials such as AMB / DBC substrates and other exotic materials. For top level interconnect, Heavy gauge wire bonding using both Aluminium or Copper wire / ribbon is the preferred method, but other interconnect technologies are being researched. This has ultimately culminated in CIL being selected by both BMW and McLaren on the APC15 funded @FutureBEV consortium, to develop SiC based power switches and associated drive electronics/sensors for BMW and McLaren inverters to be used on their future vehicles. CIL is also working with a number of other customers in this sector using IGBT / SiC / GaN based power electronics coupled with heavy copper PCB's capable of operating at 150ºC and high vibration enviroment's
CURRENT MANUFACTURING CAPABILITIES FOR BEV / PHEV SYSTEMS
6 off SMT LINES, 3 off 01005 CAPABLE AND 3 off 0402 CAPABLE
10 ZONE HOT AIR REFLOW, REFLOW IN N2, VAPOUR PHASE AND VACUUM ASSISTED VAPOUR PHASE
3D AOI WITH 15um RESOLUTION / MEASURE / FOREIGN OBJECT ALL SET TO IPC3
DAGE QUADRA 5 X-RAY SYSTEM COMPLETE WITH CT-SCAN CAPABILITY FOR VOID ANALYSIS
SONOSCAN Gen7 SCANNING ACOUSTIC MICROSCOPY (C-SAM) FOR VOID ANALYSIS OF HEAVY COPPPER CONTENT SUBSTRATES
LASER DEPANEL / CUTTER FOR ODD FORM / THIN / THICK PCB’s
FR4 HEAVY COPPER TO 6oz, 8oz, 10oz & 12oz
SMALL CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICES ONTO MULTIPLE SUBSTRATE TYPES
SMALL CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE BONDING
PACKAGED IGBT / SiC / GaN POWER DEVICE SOLDERING WILL VERY LOW LEVELS OF VOIDING
PROTOTYPE CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICE
PROTOTYPE CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE / RIBBON BONDING
FUTURE MANUFACTURING CAPABILITIES FOR BEV / PHEV SYSTEMS
SMALL, MEDIUM AND VOLUME CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICES ONTO MULTIPLE SUBSTRATE TYPES
SMALL, MEDIUM AND VOLUME CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE BONDING
VOLUME SMT LINE FOR PRODUCTION MANUFACTURE OF BEV INVERTER PCBA
FULL SUITE OF ESS EQUIPMENT FOR AUTOMOTIVE QUALIFICATION
COMPLETE BEV INVERTER ASSEMBLY FACILITY TO 800v OPERATION
Get in touch with Custom Interconnect today and learn how our industry leading team can help your Automotive BEV & PHEV needs.