Automotive BEV & PHEV Systems

CIL has extensive knowledge and manufacturing experience of Automotive BEV & PHEV Electronic systems using ruggedised knowhow gained from 15 years of Oil & Gas PCBA production. This coupled with CIL's Advanced Technology excellence dealing with bare die processing and Heavy gauge Aluminium / Copper wire bonding gives CIL un-rivalled BEV & PHEV manufacturing capability. CIL is at the forefront of Silicon Carbide SiC and Gallium Nitride GaN packaging using Silver Sinter technology onto high thermal transfer materials such as AMB / DBC substrates and other exotic materials. For top level interconnect, Heavy gauge wire bonding using both Aluminium or Copper wire / ribbon is the preferred method, but other interconnect technologies are being researched. This has ultimately culminated in CIL being selected by both BMW and McLaren on the APC15 funded @FutureBEV consortium, to develop SiC based power switches and associated drive electronics/sensors for BMW and McLaren inverters to be used on their future vehicles. CIL is also working with a number of other customers in this sector using IGBT / SiC / GaN based power electronics coupled with heavy copper PCB's capable of operating at 150ºC and high vibration enviroment's

 

CURRENT MANUFACTURING CAPABILITIES FOR BEV / PHEV SYSTEMS

6 off SMT LINES, 3 off 01005 CAPABLE AND 3 off 0402 CAPABLE

10 ZONE HOT AIR REFLOW, REFLOW IN N2, VAPOUR PHASE AND VACUUM ASSISTED VAPOUR PHASE

3D AOI WITH 15um RESOLUTION / MEASURE / FOREIGN OBJECT ALL SET TO IPC3

DAGE QUADRA 5 X-RAY SYSTEM COMPLETE WITH CT-SCAN CAPABILITY FOR VOID ANALYSIS

LASER DEPANEL / CUTTER FOR ODD FORM / THIN / THICK PCB’s

FR4 HEAVY COPPER TO 6oz, 8oz, 10oz & 12oz

PACKAGED IGBT / SiC / GaN POWER DEVICE SOLDERING WILL VERY LOW LEVELS OF VOIDING

PROTOTYPE CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICE

PROTOTYPE CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE / RIBBON BONDING

 

FUTURE MANUFACTURING CAPABILITIES FOR BEV / PHEV SYSTEMS

SMALL, MEDIUM AND VOLUME CAPABILITY OF SILVER SINTER DIE ATTACH OF SiC / GaN DEVICES ONTO MULTIPLE SUBSTRATE TYPES

SMALL, MEDIUM AND VOLUME CAPABILITY OF HEAVY GAUGE ALUMINIUM / COPPER WIRE BONDING

VOLUME SMT LINE FOR PRODUCTION MANUFACTURE OF BEV INVERTER PCBA

SCANNING ACOUSTIC MICROSCOPY (C-SAM) FOR VOID ANALYSIS OF HEAVY COPPPER CONTENT SUBSTRATES

FULL SUITE OF ESS EQUIPMENT FOR AUTOMOTIVE QUALIFICATION

COMPLETE BEV INVERTER ASSEMBLY FACILITY TO 800v OPERATION

 

 

 

 

 

 

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Connexion
Custom Interconnect Limited is a Connexion Technologies Company, see the Corporate Tab for full details