Automotive BEV & PHEV
At Custom Interconnect Limited we have an unrivalled assembly capability to anywhere in the UK. With an extensive SMT PCB assembly facility, a state of the art high power die and wire bond assembly facility and a rapidly growing diagnostic equipment portfolio, our power electronics boast high quality production and superior technology for your battery engine vehicles (BEV) and plug-in hybrid electric vehicles (PHEV).
Our Power Electronic Packaging Capabilities
Our current manufacturing capabilities for BEV and PHEV include the following:
- 8 off SMT lines, all 01005 / BGA / WLCSP capable
- 10 zone hot air reflow, reflow in N2, In-line 10 zone hot air with Vacuum assist and vapour phase / vacuum assisted vapour phase
- 3d AOI with 15um resolution / measure / foreign object all set to IPC3
- Dage QUADRA 5 x-ray system complete with CT-Scan capability for void analysis
- Sonoscan GEN7 scanning acoustic microscopy (C-SAM) for void analysis of heavy copper content substrates
- Laser depanel / cutter for odd form / thin / thick PCBs
- FR4 heavy copper to 6oz, 8oz, 10oz, 16oz and 32oz
- Silver sinter die attach of SiC / GaN devices onto multiple substrate types
- Heavy gauge Aluminium / Copper wire bonding
- Packaged IGBT / SiC / GaN power device soldering will very low levels of voiding <1%
- Prototype capability of silver sinter die attach of SiC / GaN device
- Prototype capability of heavy gauge aluminium / copper wire / ribbon bonding
Furthermore, we are able to provide the below:
Interconnect Technologies include:
- Silver Sinter die attach
- Silver Sinter top level interconnect
- Silver Sinter both low/pressure-less and High Pressure methods
- Eutectic Soldering using Formic Acid soldering techniques
- Laser Soldering
Packaged SiC types include
- ST Micro STPAK
- ST Micro SCTG011H75G3AG
- Wolfspeed WM4
- ON SEMI
- Hitachi
- Multiple other packaged types
Die types include:
- Silicon Carbide SiC
- Gallium Nitride GaN
- IGBT
- Mosfet's
- Multiple other die types
Substrate materials include:
- Alumina or other Metallised ceramics.
- DBC Direct Bonded Copper substrates
- AMB Active Metal Brazing substrates
- AiN substrates
- Copper
- Copper Tungsten
- Aluminium Backed & Aluminium
- Other high thermal materials
Heavy Gauge Wire Bonding includes:
- Aluminium (Al) to 600um wire
- Aluminium (Al) to 2.00mm ribbon
- Copper to (Cu) 600um wire
- Copper to (Cu) 2.00mm ribbon
- Aluminium/Copper (AlCu) to 600um wire
- Aluminium/Copper (AlCu) to 2.00mm ribbon
Our experience with BEV and PHEV vehicles
CIL has extensive knowledge and manufacturing experience in Automotive BEV & PHEV Electronic systems. Using ruggedised knowhow gained from 15 years of Oil & Gas PCBA production and our Advanced Technology excellence dealing with bare die processing, we create state of the art components for both BEV and PHEV vehicles. Our heavy gauge aluminium / copper wire bonding similarly give CIL un-rivalled BEV & PHEV manufacturing capability.
CIL is at the forefront of Silicon Carbide (SiC) and Gallium Nitride (GaN) packaging using silver sinter technology onto high thermal transfer materials such as AMB / DBC substrates and other materials. For top level interconnects, heavy gauge wire bonding using both aluminium or copper wire / ribbon is the preferred method, but other interconnect technologies are being researched. In the future we hope to offer the following capabilities:
- Small, medium and volume capability of silver sinter die attach of SiC / GaN devices onto multiple substrate types
- Small, medium and volume capability of heavy gauge aluminium / copper wire bonding
- Volume SMT line for production manufacture of BEV inverter PCBA
- Full suite of ESS equipment for automotive qualification
- Complete BEV inverter assembly facility to 800v operation
Our expertise and knowledge have ultimately culminated in being selected by both BMW and McLaren on the APC15 funded @FutureBEV consortium, to develop SiC based power switches and associated drive electronics/sensors for BMW and McLaren inverters to be used on their future vehicles. We also work with a number of other customers in this sector using IGBT / SiC / GaN based power electronics coupled with heavy copper PCB's capable of operating at 150ºC and high vibration environments.
Get in contact with a member of our friendly sales team for more information on our BEV & PHEV power electronic capabilities today