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Home
Services
Electronics Manufacturing
SMT Board Assembly
Conventional PCB Assembly
Inspection & Testing
Production Engineering Services
Advanced Technologies
Die Bonding
Wire Bonding
MCM & Custom BGA's
LED & Thermal Management
Chip / Die repackaging & obsolescense
Power Electronics
Design Services
Design Partner: ASH Wireless
Design Partner: Ensilica
Power Electronics for BEV & PHEV Vehicles
Box Build
Rapid Prototypes
Sectors
Aerospace & Space Tech
Automotive BEV & PHEV
Communications
Defence & Homeland Security
Industrial
Medical & Laboratory
Oil & Gas
Transportation Infrastructure
Industry Expertise
High Temperature Soldering
Solder Jet Printing
RF Testing
Component Staking
Conformal Coating
PCBA Cleanliness
BGA Rework
X-Ray Assessments using
Temperature Cycling
Power Electronics for BEV / PHEV Vehicles
Dri-Store in Nitrogen
Chip repackaging / Obsolescence
BGA LGA CSP Underfill
3D Automatic optical Inspection (AOI)
Flying Probe Test
Corporate
A Brief History
Our Vision, Mission & Values
CIL Supply Chain
CIL's Approved Suppliers
Customer Nominated Suppliers
Consolidated Purchasing
Anti-Counterfeiting
Obsolescence Monitoring
Materials Storage & Control
Quality Assurance
Quality Control
New Product Introduction
Continuous Improvement
Counterfeit Avoidance
Case Studies
Downloads
Connexion Technologies
Privacy Policy
Accessibility
Careers
Current Vacancies Available
Employee Benefits
Why join Custom Interconnect
Meet our Senior Managers
News
Contact Us
