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Home
Services
Electronics Manufacturing
SMT Board Assembly
Conventional PCB Assembly
Inspection & Testing
Production Engineering Services
Advanced Semiconductor Packaging (OSAT)
Wafer Dicing
Die Bonding
Wire Bonding
COB - Chip on board
Plastic Packaging
WBG Power Device SiC & GaN
MCM & Custom BGA's
System in Package (SiP)
LED & Thermal Management
Chip / Die repackaging & obsolescense
Power Electronics for BEV & PHEV Vehicles
Rapid Prototypes
Box Build
Design Services
Design Partner: ASH Wireless
Design Partner: Ensilica
Sectors
Medical & Laboratory
Communications
Automotive BEV & PHEV
Industrial
Oil & Gas
Aerospace & Space Tech
Defence & Homeland Security
Transportation Infrastructure
Industry Expertise
Power Electronics for BEV / PHEV Vehicles
X-Ray Assessments
CSAM Assessments
Solder Jet Printing
High Temperature Soldering
RF Testing
Component Staking
Conformal Coating
PCBA Cleanliness
BGA Rework
Temperature Cycling
Dri-Store in Nitrogen
Chip repackaging / Obsolescence
BGA LGA CSP Underfill
3D Automatic optical Inspection (AOI)
Flying Probe Test
Corporate
A Brief History
Our Vision, Mission & Values
CIL Supply Chain
CIL's Approved Suppliers
Customer Nominated Suppliers
Anti-Counterfeiting
Obsolescence Monitoring
Materials Storage & Control
Quality Assurance
Quality Control
New Product Introduction
Continuous Improvement
Counterfeit Avoidance
Case Studies
Downloads
Privacy Policy
Accessibility
Careers
Current Vacancies Available
Employee Benefits
Why join Custom Interconnect
Meet our Senior Managers
News
Contact Us
