CIL's provides bonding of bare die using conductive, non-conductive die attach materials, eutectic solders and Silver Sintering techniques. We process production volumes of several 100,000 die per month down to single die and batches of one. We have three fully automatic die placement machines, with two of these being high accuracy machines, for larger die and more complex component handling. When you consider that CIL compliments this with Automatic Wire Bonding it provides for a complete micro packaging solution.
Our bare die placement capability, in terms of positional accuracy, is achieving better than 10 microns in both X & Y, and a theta accuracy of better than 1.0 degree. We have extensive experience in placing and running production quantities of IGBT, SiC, GaN, ASIC, MEMS, LED, Laser, Detectors, Medical Sensors and all commercially available die types. Using our Non-Contact Coordinate Measurement station, we can verify placement accuracy to a resolution of better than 1/10 of a micron. Die sizes processed can vary from 0.3mm x 0.3mm up to 100.0mm x 150.0mm and can be of any semiconductor material.
We can bond die to a variety of substrates, and as new or revised materials and structures become available we are able to conduct controlled Shear Testing in-house using our Dage Die Shear & Wire Pull Test Station to ensure that appropriate standards for die attach and its shear strength are met.
We also have on site numerous N2 storage cabinets for the long term storage of wafers / die. Substrate materials bonded to include
Call Business Development, and arrange a visit to meet the CIL Advanced Technology Group in order to explore applications and manufacturing methods available.