CIL INSTALLS A 3RD VOLUME AUTO SMT LINE WITH IN-LINE 3D AOI AT ITS BP2 FACILITY
In early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility.
In early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility.
CIL are proud to announce they won the "Excellence in Innovation" at the National Electronics Industry Awards.
CIL is thrilled to announce that we are proud finalist for the Elektra Awards 2024.
As part of its on-going commitment to quality, in addition to its existing Andover based CIL House and Rennie Gate facilities, CIL has now extended all three quality accreditations to…
And that’s a wrap for APC15FutureBEV project, nearly 4 years of teamwork that brought together vision, ambition and passion.
Well done to the team at Custom Interconnect Ltd for being short listed for the two business awards “Electronics Manufacturer of the Year” and “Excellence in Innovation” and Symon Franklin for…
In recent months much of CIL’s activities have been concentrated on its Semiconductor packaging and volume PCB assembly capability from its BP2 facility.
International Women in Engineering Day (#INWED24) was born to enable the celebration of women in engineering to become global.
CIL maintains its pole position with Nordson DAGE QUADRA 7 Pro X-ray inspection addition at its BP2 Semiconductor packaging and volume PCBA facility.
As geopolitical tensions proliferate, relying on Far Eastern semiconductor component imports becomes riskier than ever. Here’s how one UK electronics manufacturer has used advanced technology to mitigate the problem.