What if the future of regional flight was hybrid-electric—and closer than you think? CIL joins a diverse group of 24 EU industrial, research, and academic partners to make it reality …
Following further investment in advanced packaging capability at its BP2 OSAT facility, CIL has brought on-line the UK’s first PacTech SB² – Jet solder ball laser reflow system.
Following significant contract wins for its Semiconductor packaging OSAT services and complex PCBA manufacture, CIL has commenced construction of the next stage of the BP2 facility in Hampshire.
Custom Interconnect has been awarded Manufacturing Site of the Year at the TechWorks Awards 2025.
As geopolitical tensions proliferate, relying on Far Eastern semiconductor component imports becomes riskier than ever. Here’s how one UK electronics manufacturer has used advanced technology to mitigate the problem.
Custom Interconnect celebrates the successful completion of the Innovate UK DER PE2M project, delivering UK-manufactured SiC power modules to support electric vehicle innovation and future net zero technologies.
The ELEKTRA Awards 2024 were presented at a Gala Dinner at the IET London, Savoy Place on Tuesday 10th December.
In early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility.
CIL are proud to announce they won the "Excellence in Innovation" at the National Electronics Industry Awards.
CIL is thrilled to announce that we are proud finalist for the Elektra Awards 2024.
