APC15@FutureBEV project completion after 4 years of collaboration
And that’s a wrap for APC15FutureBEV project, nearly 4 years of teamwork that brought together vision, ambition and passion.
And that’s a wrap for APC15FutureBEV project, nearly 4 years of teamwork that brought together vision, ambition and passion.
Well done to the team at Custom Interconnect Ltd for being short listed for the two business awards “Electronics Manufacturer of the Year” and “Excellence in Innovation” and Symon Franklin for…
In recent months much of CIL’s activities have been concentrated on its Semiconductor packaging and volume PCB assembly capability from its BP2 facility.
International Women in Engineering Day (#INWED24) was born to enable the celebration of women in engineering to become global.
CIL maintains its pole position with Nordson DAGE QUADRA 7 Pro X-ray inspection addition at its BP2 Semiconductor packaging and volume PCBA facility.
As geopolitical tensions proliferate, relying on Far Eastern semiconductor component imports becomes riskier than ever. Here’s how one UK electronics manufacturer has used advanced technology to mitigate the problem.
As part of its continued investment in the semiconductor packaging of Si sensors, GaN RF MMIC QFN's, SiC and GaN power devices, CIL now installed a 3rd DATACON 2200EVO Auto…
In early November 2023, CIL completed the installation of its first volume SMT PCBA assembly line at its BP2 Semiconductor packaging facility.
On Wed 1st Nov 2023, CIL completed its transfer of all micro-electronics and power device staff and equipment into its new world class semiconductor packaging facility and it is now…
On Friday 26th May 2023, CIL commenced transfer of all micro-electronics and power device staff and equipment into its new world class semiconductor facility in Andover UK.