CIL's GOES LIVE WITH THE UK's LARGEST SEMICONDUCTOR PACKAGING FACILITY
Wafer dicing and semiconductor plastic overmold have been added to CIL's UK capability in the new facility.
Wafer dicing and semiconductor plastic overmold have been added to CIL's UK capability in the new facility.
12 months in the planning and fit out and we are now only 1 week away from being able to move into the new facility.
It's been 6 months since CIL announced it's newly created and UK based advanced semiconductor packaging facility.
The ELEKTRA Awards 2022 were presented at a Gala Dinner at the Grosvenor House, Park Lane on Wednesday 30th November.
CIL is excited to announce that it is creating an advanced semiconductor packaging, power device and volume PCB Assembly (PCBA) manufacturing facility in the UK.
Due to continued exceptional growth, Custom Interconnect Ltd has invested in its fourth MYCRONIC MY300DX SMT machine / DEK NeoHORIZON 03iX / Vitronics Soltec 10 zone reflow oven combination.
Driving the Electric Revolution Industrialisation Centres (DER-IC) has supported its partners in successfully winning nine bids in the latest Driving the Electric Revolution funding call from UK Research and Innovation.
DER-IC Success in UKRI Supply Chains for Net Zero Competition Driving the Electric Revolution Industrialisation Centres (DER-IC) has supported its partners in successfully winning nine bids in the latest Driving the…
DCMS Announce 15 UK Consortia-Led Projects To Deliver Open-RAN As Part Of A £36m Investment To Support Telecom Supply Chain Diversification Custom Interconnect Ltd (CIL) is pleased to play a central…
Well done to the team at Custom Interconnect Ltd for being short listed for the two business awards, “Electronics Manufacturer of the Year” and “Excellence in Innovation” at this year’s…