As part of its continued investment in the semiconductor packaging of Si sensors, GaN RF MMIC QFN's, SiC and GaN power devices, CIL now installed a 3rd DATACON 2200EVO Auto…
In early November 2023, CIL completed the installation of its first volume SMT PCBA assembly line at its BP2 Semiconductor packaging facility.
On Wed 1st Nov 2023, CIL completed its transfer of all micro-electronics and power device staff and equipment into its new world class semiconductor packaging facility and it is now…
On Friday 26th May 2023, CIL commenced transfer of all micro-electronics and power device staff and equipment into its new world class semiconductor facility in Andover UK.
Wafer dicing and semiconductor plastic overmold have been added to CIL's UK capability in the new facility.
12 months in the planning and fit out and we are now only 1 week away from being able to move into the new facility.
It's been 6 months since CIL announced it's newly created and UK based advanced semiconductor packaging facility.
The ELEKTRA Awards 2022 were presented at a Gala Dinner at the Grosvenor House, Park Lane on Wednesday 30th November.
Due to continued exceptional growth, Custom Interconnect Ltd has invested in its fourth MYCRONIC MY300DX SMT machine / DEK NeoHORIZON 03iX / Vitronics Soltec 10 zone reflow oven combination.
