Semiconductor Packaging facility update with 1 week to go

12 months in the planning and fit out and we are now only 1 week away from being able to move into the new facility. CIL's new 46,000sq ft semiconductor packaging facility for micro-electronics and power device assembly is nearly ready. At the far end of the cleanroom we have built a segregated room with specialist LED lighting to house CIL's wafer dicing capability complete with DISCO DAD3361 dicing saw and wafer mounting equipment.

                                                                                 15,000sq ft ISO7 (Class 10,000) Cleanroom with wafer dicing

Over the next 3 months, all of CIL's semiconductor packaging equipment and personnel will transfer from CIL's two other Andover UK locations leaving room for further expansion in the 32,000sq ft of manufacturing space.

                                                                           New offices for the first 40 semiconductor packaging engineers