Power Electronics

CIL's Power micro-electronics packaging facility is at the forefront of the EV power revolution primarily used in Automotive BEV & PHEV drivetrain systems. Centred around Silicon Carbide (SiC) and Gallium Nitride (GaN) power packaging using Silver Sinter die attach techniques, CIL has the most advanced capability in the UK. Top level connectivity is normally achieved with Heavy Gauge Aluminium or Copper wire/ribbon with wire diameter up to 600um and CIL is also involved with Tier 1 OEM's researching low cost/high reliability methods of connection that is not wire bonded. This has ultimately culminated in CIL being selected by both BMW and McLaren on the APC15 funded @FutureBEV consortium, to develop SiC based power switches and associated drive electronics/sensors for BMW and McLaren inverters to be used on their future vehicles. CIL is also working with a number of other customers in this sector and multiple other sectors using IGBT / SiC / GaN based power electronics

Substrate materials include

Alumina or other Metallised ceramics.

DBC Direct Bonded Copper substrates

AMB Active Metal Brazing substrates

AiN substrates

Copper

Copper Tungsten

Aluminium Backed & Aluminium

Other high thermal materials

Heavy Gauge Wirebonding includes

Aluminium (Al) to 600um wire

Aluminium (Al) to 2.00mm ribbon

Copper to (Cu) 600um wire

Copper to (Cu) 2.00mm ribbon

Aluminium/Copper (AlCu) to 600um wire

Aluminium/Copper (AlCu) to 2.00mm ribbon

All of this assembly capability is backed up with wirebond pull and die shear test capability. The detection of voiding under power devices is critical, so CIL uses its in-house Dage QUADRA5 X-ray / CT Scan system and will soon also have in-house Scanning Acoustic Microscopy (C-SAM) capability.

Power Electronics

Power Electronics

Custom Interconnect Limited is a Connexion Technologies Company, see the Corporate Tab for full details