Inspection & Product Testing
At Custom Interconnect, all In-Process Inspection of Electronics Assemblies are pre-defined within a product specific routing which details the Inspection & Test Plan for the product. This provides for a defined inspection routing which is dependent upon product maturity, and all previous Inspection results. The process routing for each different assembly is jointly agreed by Production Engineering & Quality Assurance, and will consist of one or more of the following inspection types:-
- First Off Machine and process verification checks.
- Batch Inspections, using human, visual Inspection schedules and check lists.
- Koh Young ZENITH 2 3D AOI, Automated Optical Inspection x 2
- Dage QUADRA5 Digital X-Ray Inspection with X-Plane and CT Scan x 1
- TAKAYA APT-1400F Flying probe test FPT x 2, with "Test Expert" software package
- NORDSON SONOSCAN GEN7 Scanning Acoustic Microscope (SCAM)
- 100% Functional test specialising in RF frequencies
- Outgoing Inspection Schedules.
- Sample Inspections, used at Goods Inwards Inspection stages.
- First Article Inspection Report, to cover the entire verification plan.
Our In-Process Inspection Team and Quality Assurance staff have available to them two Koh Young Zenith2 3D AOI Inspection systems for use on SMT, conventional and mixed technology PCB assemblies. In addition to the Zenith2 3D AOI machines, we also have the complete suite of associated KSMART software packages from Koh Young. These software tools are used for remote line monitoring, offline programming, offline fine tuning and foreign object material inspection. The Zenith2 3D systems are set to both inspect the component and all associated solder joints and as well as optical inspection, they are also measured to within 15 microns on 100% of components and solder joints. We have a high number of microscopes and vision systems, up to and including 1000 X times magnification available, and may be used in conjunction with our own on-site Non-Contact Coordinate Measurement station, 3D X-ray or we have full access to Electron Scanning Microscopes.
The Test & Inspection Plan defines the required type and level of product testing required for each product under manufacture. The plan is produced as an output from our NPI Engineering process, thereby ensuring that, where required, all functional and in circuit test attributes are verified using the specified methods during the ongoing production process.
It is the preference at CIL to provide our customers with a comprehensive full product test, thereby ensuring that our Customers only receive fully conforming product. In order that we achieve this, we use a combination of our TAKAYA APT1400F Flying Probe Testers and a wide range of Functional testing equipment including, JTag and X-JTAG, Labview Test Simulation and Teradyne combinational testers.
Full Product Functional Testing may be an in-process requirement or as an outgoing product quality measure. This can also be fully accommodated at our Box Build facility who are able to provide a full product testing service for our Customers.
As part of developing a full Test & Inspection strategy for the product, we can provide optional temperature cycling and stress testing as we have a number of Stress Screening Chambers and elevated temperature ovens, as well as a Screened Room for RF Testing at power and RF Isolation.